Electronics Incorporated - The Shot Peener - Shot Peening Library
Title: Ceramic Dispersion Plating Process
Author: Yoshio Miyasaka, Aichi, Japan
Source: US Patent 6,156,377
Publication year 2000
Document number: 2000021
Number of pages: 5
Abstract:
ABSTRACT
Provided is a low-priced metal coating, treatment which causes less pollution, wherein the dispersion of ceramics and the forming of a metal coat are performed by blasting
treatment; and a ceramic dispersion plating process making it possible to improve wear resistance, heat resistance and the like of a workpiece and the adhesion of the metal
coat. When ceramic particles are ejected on the surface of a workpiece comprising a metal or a metal component by blasting, the workpiece is heated and softened so that the
ceramic particles are dispersed inside the workpiece to form a dispersed layer. When a coating metal powder is further ejected thereon by blasting, the temperature of the
dispersed layer rises in the same way so that elements in the composition of the coating metal powder diffuse and penetrate inside/on the surface of the dispersed layer to
form a plating layer.
Download full text pdf file
www.shotpeener.com
This page last revised: 04/24/2008