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Title: On-aircraft Shot Peening Application Using The Stressonic® Process
Author: Duchazeaubeneix, Desfontaine, Forgues, Labelle
Source: Conf Proc: ICSP-10 Tokyo, Japan 2008
Publication year 2008
Document number: 2008101
Number of pages: 9

Abstract:
ABSTRACT Aerospace operators are always looking at methods of reducing the down time of their components while ensuring a high level of control and safety in their maintenance operations. Until recently, shot peening of components while fully assembled on the aerospace (aircraft/helicopter) has resulted in a process that was either lacking in control or that created a very high risk of foreign object damage (FOD). We will show the potential interest by using ultrasonic technology for reducing maintenance cost and increase fatigue life.

This ICSP paper is not available until September of 2011. You may purchase the complete conference procedings ICSP-10 for $230 at Electronics Inc +1-574-256-5001

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