Hi Dr. Peener,
Peening is basically creating a plastically-deformed surface layer such that compressive residual stresses prevents the formation of surface defects or slows down their growth under fatigue loading. I understand that the recrystallization of deformed grains also occurs more easily and the reduction in recrystallization temperature is related to the degree of deformation. Will the effects of peening be fully- or partially-negated if the peened surface is subsequently thermal-sprayed or baked after electroplating?
For single-crystal alloys, will peening actually cause the formation of unwanted surface grains when the component undergoes a stress relieve heat treatment to reduce/eliminate the effects of fatigue loading? How does re-peening of the same areas salvage the situation?