Development of a peening device with a handheld laser on a collaborative robot

Author:  Y. Sano1,2,3, Y. Mizuta1, S. Tamaki3, K. Yokofujita4, K. Masaki5, T. Hosokai1 and T. Taira2 1 SANKEN, Osaka University, Ibaraki, Japan 2 Institute for Molecular Science, National Institutes of National Sciences, Okazaki, Japan 3 LAcubed Co. Ltd., Yokohama
Source:  ICSP14 Milan
Doc ID:  2022064
Year of Publication:  2022
A compact laser peening (LP) device has been developed for application to large structures such as bridges in service. The device consists of a thumb-sized handheld laser mounted on a collaborative robot, a power supply, a water circulation system, and a PC as a control unit. Various materials such as aluminum alloys and high-strength steels were laser-peened by using this device. Results of residual stress (RS) evaluation and fatigue experiments showed that LP with this device significantly improved the RSs in the near-surface layer and fatigue properties of materials. Keywords Microchip laser, robotic arm, laser peening, residual stress, fatigue

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